Article · Materials Today Proceedings · January 1, 2017

The formation of Ti x N y and Ta x N y -based diffusion barriers

Kair Kh. Nussupov, Н. Б. Бейсенханов, И. К. Бейсембетов, Б. К. Кенжалиев, Bekbolat Seitov, E. Dulatuly

Copper Interconnects and ReliabilitySemiconductor materials and interfacesMetal and Thin Film Mechanicstitanium nitridetantalum nitridediffusion barrier

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